Description :
• Based on Microspire’s «SESI22 Planar Technology»
• Low-profile SMD package (2x4 pins)
• Applied standards : MIL-STD-202, ECSS-Q-70-02, DO-160
• Dielectric strength test up to 500 V (50 Hz - 1 min)
• Materials meet UL94-V0 rating
• Thermal index according to IEC85 : H (180 °C)
• Operating/storage temperature range : - 55 °C to + 125 °C
• Approx weight : 26 grams


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